Friday, Jun. 8th, 4:30 - 5:30 pm, ESB 2001
Communications networks and systems are seeing extreme increases in network traffic which is growing at the tremendous rate of 30% per year. It is estimated that the energy and cost requirements will increase tenfold in coming year. But this progress is not sustainable from an ecological and economic point of view. However, this information explosion can be dealt with, using the integration of very small photonic components on very high density Photonic Integrated Circuits (PICs). The technolgoical advancements in PICs have made them a popular choice for components of next generation networks. Silicon being the evident choice due to its high availability, mature fabrication technology, and low cost has attracted components on a chip. At the same time, the unique, material properties and direct bandgap of group III-V materials have huge potential in applications like laser amplifiers, modulators, and detectors. Due to robustness, flexibility, reliability, and performance of PICs, many commercial solutions are now available for a variety of applications.